SANTA CLARA, Calif., July 29, 2024 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, and its San Diego-based division QP Technologies, a leading provider of innovative microelectronic packaging and assembly solutions, today announced a sales/marketing reorganization aimed at growing both companies’ core businesses. As part of this effort, key changes have been implemented at the executive level at both sites. Rosie Medina, who has served as vice president of sales and marketing for both companies over the past several years, was named senior vice president of sales and marketing for Promex’ Santa Clara site.

“As our business expands, we are focused on engaging with a broader customer set,” said Dave Fromm, Promex chief operations officer. “Rosie has proven adept at establishing and building customer relationships. In her new role, she will take the lead in identifying new customers and educating them about Promex’s central value: helping solve difficult product development problems and building complex, high-value subassemblies for advanced applications such as medtech/biotech devices and MEMS and sensors.”

On the QP Technologies side, Matt Hansen has been promoted to VP of sales and marketing from his prior position as director of sales and business development for Promex. In this role, Hansen will leverage his experience to pursue new customers for QP Technologies in such key markets as the rapidly growing military-aerospace arena. Already ITAR-registered, the company is actively pursuing certification in AS9100, the international Quality Management System standard for the aviation, space and defense industry. Compliance with AS9100 is vital to gaining access to large OEMs and the broader supply chain.

Ken Molitor, chief operating officer for QP Technologies, noted, “Rosie has done a fantastic job for us over the past nine years. With that said, Matt’s two-plus decades of experience in sales and business development and proven track record in revenue growth make him a valued addition to the QP team. We are the leader in quick-turn and low-medium volume, turnkey onshore IC packaging and assembly services, and having Matt dedicated to QP Technologies will allow us to enhance our customers’ overall experience.”

The reorganization was prompted by both companies’ continued strong growth, which has also fueled expansion of their respective manufacturing lines. QP Technologies is seeing strong demand from global customers across its offerings – in particular, for its air-cavity open-molded plastic packages (OmPP) and its custom turnkey solutions for high-performance, substrate-based assemblies. Promex experienced double-digit growth in fiscal 2024 (ended June 30), driven by escalating demand for its ability to solve complex integrated device challenges, including precision miniaturization processes for MEMS and sensor devices.

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ESCONDIDO, Calif. – June 19, 2024 – QP Technologies, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has added a state-of-the-art dicing saw to its manufacturing line, expanding its die and wafer preparation business. The Disco DFD6362, QP Technologies’ first fully automated dicing system, enables a full cassette of 300mm wafers to be processed quickly and efficiently, improving turnaround time and productivity for client projects. Further extending its wafer prep proficiencies, the company recently installed an additional die sorter, a Royce Autoplacer MP 300, enabling precise, mechanized, non-surface-contact pick-and-place of die during assembly.

The new Disco DFD6362 tool delivers about 7% higher throughput compared to existing equipment under the same conditions, thanks to its higher dual-cut processing speed and improved X-axis processing feed speed. The tool’s automated flow smoothly moves workpieces between the cassette, the chuck table (for cutting), and the spinner table (for cleaning and drying). The tool quickly and efficiently cuts narrower streets, enabling customers to fit more die onto their costly wafers, increasing throughput and speeding time to market for their devices.

“We are seeing heightened demand for our die preparation services as customers are building die on larger wafers,” said Ken Molitor, QP Technologies’ chief operating officer. “As a longtime Disco customer, we selected the DFD6362 not only for its ability to handle 300mm wafers in high volumes, but also its improved quality and precision. We are excited at the new opportunities we see on the horizon for our full complement of services.”

The U.S. CHIPS and Science Act and other government-funded technology programs are fueling reshoring of semiconductor manufacturing by establishing the innovation ecosystem needed to optimize new chip fabrication facilities. As chipmakers build and bring these new, high-volume fabs online, they will be seeking U.S.-based companies that can deliver wafer prep, packaging and assembly. With its proven capabilities, team of skilled experts, and broadened equipment line, QP Technologies is well positioned to play an even more vital role in this new ecosystem.

Visit QP Technologies in booth 842 at Sensors Converge, June 24-26, 2024, at the Santa Clara Convention Center to learn about the company’s full portfolio of wafer preparation, packaging and assembly, and substrate development capabilities, and their application for a range of device types, including MEMS and sensors. At the conference, David Fromm, COO of QP Technologies’ parent company Promex Industries, will give a presentation titled “Design Considerations for Building Heterogeneously Integrated Devices” on Tuesday, June 25, 2:40-3:00 p.m., in Grand Ballroom G.

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ESCONDIDO, Calif. – April 11, 2024 – QP Technologies, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has been certified ANSI/ESD S20.20-compliant by TÜV SÜD America Inc. – one of only six certification bodies accredited to issue ESD S20.20 certificates. Established and governed by the American National Standards Institute (ANSI), the ESD S20.20-2021 standard provides requirements for establishing, implementing, and maintaining an electrostatic discharge (ESD) control program.

Defined by ANSI as “the rapid, spontaneous transfer of electrostatic charge induced by a high electrostatic field,” ESD has the potential to cause great damage to or even destroy electrical and electronic products, parts and materials. Implementing documented processes for monitoring and control of ESD is vital to ensuring product quality.

In January 2024, TÜV SÜD representatives performed an intensive audit of QP Technologies’ manufacturing facility in Escondido, California. The certifications team confirmed the ESD safety and compliance of QP Technologies’ IC packaging and microelectronic assembly line. The company’s quality engineers are trained to perform monthly monitoring and recordkeeping to maintain compliance. The resistivity of all surfaces that come in contact with parts, components and packages is measured, including furniture, table and floor mats, racks, shelves, carts, trays, and personal protective equipment (PPE) worn by packaging and assembly technicians, such as wrist straps, heel straps and ESD shoes. To be classed as ESD safe, a material’s surface resistance must not exceed 1x 10E¹¹ Ω/square.

“Multiple customers, particularly larger companies, have increasingly requested that we become ESD certified. While we have taken steps to minimize ESD damage for many years, as a result of this latest audit, we have added and are regularly performing additional testing and monitoring processes to qualify all of the equipment and materials we use throughout our manufacturing line,” said QP Technologies Director of Quality Assurance Annette Aquino. “Having a formal ESD S20.20-certified facility with an ESD control program in place further assures customers of our role as a trusted partner.” The ESD S20.20 standard applies to organizations that manufacture or handle electrical and electronic parts and equipment susceptible to damage by ESD ≥100V human body model and 200V charged device model. ESD can occur due to human contact with an electrical part, or to static created through the part’s interaction with other materials. This latest certification comes on the heels of QP Technologies’ recent update of its ISO 9001:2015 and ISO 13485:2016 certifications through TÜV SÜD, exemplifying the company’s comprehensive commitment to quality and safety.

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QP Technologies

In July 2023, TÜV SÜD representatives performed an intensive one-week audit onsite at QP Technologies’ manufacturing facility in Escondido, California. During the audit, the certifications team confirmed the quality assurance system and general operative processes for QP Technologies’ IC assembly, packaging and microelectronic assembly services were in conformance to the ISO standards. “This updated certification of our facilities is vital to our ongoing commitment to deliver the utmost quality of work to our customers, providing an additional level of trust in our packaging and assembly processes,” said Annette Aquino, QP Technologies’ quality assurance manager.

TÜV SÜD’s large global footprint as well its comprehensive certification capabilities convinced QP Technologies to replace its prior ISO registrar firm. Ken Molitor, QP Technologies’ chief operating officer, noted, “Working with TÜV SÜD will allow us to pursue additional certifications – most notably, AS9100, which is key to reaching the broader aerospace and defense markets.” Compliance with AS9100 is required by major aerospace manufacturers and suppliers as a condition of doing business with them.

TÜV SÜD is accredited by the ANSI National Accreditation Board (ANAB), a subsidiary of the American National Standards Institute (ANSI). ANAB is also a member of the International Accreditation Forum (IAF), a worldwide association of accreditation and other bodies that exist to assess and assure businesses conform to a wide range of management systems and processes. This extensive pedigree ensures the credibility of TÜV SÜD’s programs, including electrostatic discharge (ESD) certification, which QP Technologies will also pursue going forward.

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ESCONDIDO, Calif. – March 16, 2023 – QP Technologies, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has extended its broad plastic package assembly portfolio with two new offerings: a 64-pin thin quad flat pack (TQFP) and a 52-pin metric quad flat pack (MQFP) plastic encapsulated package. These options are ideal for military-aerospace (mil-aero), automotive, industrial and other applications requiring cost-sensitive, robust device packaging that provides high thermal and electrical performance.

The 10x10mm eP TQFP package features a very thin profile (nominal 1mm thickness), ideal for tight-space applications and provides excellent thermal management. As with quad flat no-lead (QFN) packages, its backside exposed pad (ePad) construction helps to optimize power dissipation and electrical performance when soldered directly to the PCB. The 10x10mm MQFP (nominal 2mm thickness) is a popular solution for customers requiring a more basic option where package height and heat dissipation are less critical. Both packages are built at QP Technologies to JEDEC standards using industry-standard materials and tailored to accommodate the customer’s internal configuration needs.

Customers requiring stateside assembly services will benefit from having these traditional leaded plastic packages available to maintain device footprint cost-effectively and without having to tap offshore providers for this capability. For other QFP packages and pin-count options, customers can utilize QP Technologies’ OCPP [Open Cavity Plastic Package] process, which entails reclaiming their existing QFP packaged devices to build their new products.  

Meeting stringent MSL requirements 

The new packages deliver excellent performance on the JEDEC moisture sensitivity level (MSL) scale, which defines storage and handling constraints for plastic-encapsulated microcircuits during manufacturing. The MSL standard rates packaged devices from 1 to 6, based on the time period in which they can be exposed to ambient room temperature before experiencing degradation due to moisture. The lower the MSL number, the higher the package’s moisture resistance – a key consideration for devices that will be exposed to extremes of temperature over long periods of time.

Noted Kevin Coutts, director, sales and marketing for ASIC developer Device Engineering Inc. (DEI), “QP Technologies has previously delivered OCPP packages that met our customers’ standards for MSL performance. We’re seeing excellent initial results with samples of the new TQFP packages, which will allow us to offer even more flexibility in the solutions we provide to our avionics user base.”

“We tooled up these new TQFP and MQFP products to provide additional alternatives for our customers who need high-reliability solutions that can be customized to accommodate their existing footprint and configuration needs,” affirmed Ken Molitor, QP Technologies’ chief operating officer. “They are an excellent complement to our wide portfolio of custom and off-the-shelf packaging solutions, assembly capabilities, and wafer-preparation services.”

About QP Technologies

Escondido, Calif.-based QP Technologies (formerly Quik-Pak), a division of Promex Industries, provides wafer preparation, IC packaging and assembly, and substrate design and fabrication services in its 20,000-square-foot ISO 9001:2015/ISO-13485:2016-certified, ITAR-registered facility. The company’s over-molded QFN/DFN packages and pre-molded air-cavity QFN packages offer a fast, convenient solution for customer needs ranging from prototype to small-volume production. Same-day assembly services reduce customers’ time to market, while advanced assembly services can accommodate such structures as flip-chip, stacked die, SiP, chiplets, MCM and CoB. For more information, visit www.qptechnologies.com, or call 858-674-4676.

Media Contacts:

Lisa Gillette-Martin                               Rosie Medina

Kiterocket                                             QP Technologies

lgmartin@kiterocket.com                      rosie@qptechnologies.com

408-205-4732                                       858-521-3617

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BOSTON, Oct. 03, 2022 – QP Technologies (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced it is expanding its process capabilities in response to rising customer demand for its offerings, which also include wafer preparation and substrate design and development. The company has ordered new process equipment, including multiple 12-in. DISCO wafer backgrinding and dicing tools and a Nordson ASYMTEK fluid dispensing tool for encapsulation and underfill, all of which the company expects to take delivery of in 2023 or sooner. To further accommodate demand, the company is also actively hiring new team members, across all departments.

To maintain its focus on anticipating and meeting emerging market requirements, QP Technologies has added new capabilities to its portfolio as well as broadened its existing offerings. Examples include flip-chip assembly services, overmolded quad flat no-lead (QFN) packages, and RF and high-power solutions for mil-aero and other high-reliability applications. In addition, the company is expanding its focus on advanced laminates such as FR-5, BT and ABF, as well as compound semiconductors, including silicon carbide (SiC), gallium nitride (GaN) and graphene, to meet exacting requirements for products such as power and RF semiconductors.

“In fiscal 2022, we experienced another successive year of double-digit year-over-year growth, as demand for our products and services has remained high,” said Ken Molitor, QP Technologies’ chief operating officer. “Our objective has been to ensure we can continue to supply our products and solutions to our customers, while broadening our capacity to address market requirements. Expanding our team will also heighten our ability to engage in emerging sustainable markets, such as electric vehicles. Moreover, we expect to complete our AS9100 certification in fiscal 2023 – a vital designation that will allow us to serve the aerospace industry in a comprehensive manner,” Molitor concluded.

About QP Technologies
Escondido, Calif.-based QP Technologies (formerly Quik-Pak), a division of Promex Industries, provides wafer preparation, IC packaging and assembly, and substrate design and fabrication services in its 20,000-square-foot ISO 9001:2015/ISO-13485:2016-certified, ITAR-registered facility. The company’s over-molded QFN/DFN packages and pre-molded air-cavity QFN packages offer a fast, convenient solution for customer needs ranging from prototype to small-volume production. Same-day assembly services reduce customers’ time to market, while advanced assembly services can accommodate such structures as flip-chip, stacked die, SiP, chiplets, MCM and CoB. For more information, visit www.qptechnologies.com, or call 858-674-4676.

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ESCONDIDO, Calif. – Sept. 29, 2021 – QP Technologies (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, has added multiple new positions and capabilities to accommodate rising customer requirements. The company emerged from the global pandemic stronger and more successful than ever, experiencing double-digit growth (year over year) in fiscal 2020, and is poised to sustain this success going forward.

QP Technologies’ new, wholly owned facility has proved essential to the recent growth, as it was purpose-built for optimal efficiency and project flow, with more than 20,000 square feet of space to allow for future expansion. To support increased demand for volume manufacturing in a range of markets, such as automotive, aerospace, and battery technology, the company has procured additional equipment, including state-of-the-art systems to accommodate gold, aluminum, ribbon and heavy wire bonding. Furthermore, custom substrates and interposer design continue to be in high demand, while leaded plastic and quad-flat no-lead (QFN) package volumes are on the rise as customers increasingly seek stateside assembly capabilities, in line with the onshoring/reshoring manufacturing trend.

The company has expanded the customer service and manufacturing support teams and has also added key executive positions in the quality and sales organizations. Darin Valley, appointed director of quality assurance reporting directly to COO Ken Molitor, manages and oversees all quality-related activities for QP Technologies, including ongoing adherence to ISO and ITAR compliance requirements. Valley joined the company from Cohu’s Delta Design Philippines operation, where he served as general manager, overseeing high-precision and volume manufacturing of two divisions with $55 million in combined annual revenue. Before that, he held executive positions with Enovix Corp., Enerplus and First Philec Solar Corp.

Another recent addition to the management team is Tom Bianchi, named director of sales and marketing. Tom brings more than 30 years of experience to his new position, reporting to Rosie Medina, VP of sales and marketing. Most recently, Tom served as VP of sales and marketing, for 3D Glass Solutions, and prior to that, he was VP of North American sales, for Carsem Technology. Other previous roles include executive posts with Amkor Technology, Olin Corp., and Kyocera International, as well as acting as founder and president of manufacturer representative firm AccuRep Technical Sales.

“Darin has a strong track record in technology operations and risk management, which will prove vital to maintaining the quality of our offerings while continuing to expand our capabilities,” said Molitor. “Further, Tom’s expertise earned in the OSAT, semiconductor and electronics industries brings new strengths to our existing, highly skilled sales organization, allowing us to broaden our sales reach and proficiencies as we target new markets for our solutions. We are very fortunate to add these professionals to our stellar team, each member of which is an essential contributor to our surging growth.”

About QP Technologies

Escondido, Calif.-based QP Technologies (formerly Quik-Pak), a division of Promex Industries, provides wafer preparation, IC packaging and assembly, and substrate design and fabrication services in its 20,000-square-foot ISO 9001:2015/ISO-13485:2016-certified, ITAR-registered facility. The company’s over-molded QFN/DFN packages and pre-molded air-cavity QFN packages offer a fast, convenient solution for customer needs ranging from prototype to small-volume production. Same-day assembly services reduce customers’ time to market, while advanced assembly services can accommodate such structures as flip-chip, stacked die, SiP, chiplets, MCM and CoB. For more information, visit www.qptechnologies.com, or call 858-674-4676.

#   #   #

Media Contacts:

Lisa Gillette-Martin                   Rosie Medina

Kiterocket                                 QP Technologies

lgmartin@kiterocket.com          rmedina@qptechnologies.com

408-205-4732                           408-816-8035

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