• Our contribution to a U.S. Department of Energy project won a Silicon Carbide (SiC) Packaging Prize.
• Expert insights from our CEO on trending tech topics, including glass substrates and heterogeneous integration for medical devices.
• Employee Spotlight: our new VP of Finance Jeannine Serbanich.
• A preview of upcoming events and conferences.

The post February 2025 Newsletter appeared first on QP Technologies.

• Our latest blog article on custom substrates
• Promex’s latest white paper on Sensors and MEMS Packaging Assembly
• Employee Spotlight: Cassandra Filo
• Recent articles featuring our Promex experts
• A list of upcoming 2025 events where our team will be exhibiting

The post November 2024 Newsletter appeared first on QP Technologies.

Driven by the advancement of applications such as power amplifiers, RF semiconductors, and high-speed solid-state drives (SSDs)—which increasingly require compound semiconductors such as silicon carbide (SiC) and gallium nitride (GaN)—custom substrates are increasingly being employed. Intelligent design and developments leveraging advanced substrate materials are essential to success.

Each substrate type has unique properties and benefits to accommodate microelectronics device requirements. This can make design and development quite time-consuming. Besides being costly, prolonged processes are disadvantageous when coping with time-to-market (TTM) pressures. To avoid this complication, companies need a team of substrate experts who can quickly deliver small-volume packaging and assembly solutions featuring custom substrates.

Unique Substrate Requirements Require Customized Approaches

In 2021, Mixed-Signal Devices (MSD) came to QP Technologies for help in developing  complex packages required for their newest clock technologies that comprised multiple components, a multilayer substrate, overmolding, underfill, and other features. MSD customers in the aerospace and defense industries have three key supplier requirements: they must be domestic, meet International Traffic in Arms Regulations (ITAR), and be capable of quick lead times. QP Technologies met these requirements, producing six substrate designs and 30 builds, with excellent quality and cycle times, spanning only 18 months. As a result, MSD was able to release its flagship family of MS11xx oscillators with the highest performance in the industry, with exceptional TTM.

Saving Time and Money – From Substrate Design to Assembly

Another customer in the IP space, looking to avoid a complete redesign of their assembly, approached QP Technologies for our substrate design and manufacturing expertise. We were able to develop an entirely new substrate for a complex flip-chip assembly, thus preventing a costly redesign. Once again, the priority was delivering low volumes of high-quality assemblies within a short timeframe. The customer’s existing IP core test system was valued in excess of $500,000 and would have taken more than eight months to redesign. Rather than create a completely new assembly, QP Technologies saved the customer time and expense by facilitating the use of their legacy platform through an interposer-based solution. The entire project was designed, built, and assembled in under four weeks at just 10-15% of the cost of developing an entirely new assembly.

A Host of Substrate Services for a Range of Markets

QP Technologies’ substrate design, fabrication and development services fill technology gaps that standard, off-the-shelf solutions cannot. Customers increasingly leverage QP Technologies for quick-turn, small-volume custom substrate solutions for advanced applications with high-power and speed requirements; for IP verification; and for creation of test boards and samples.

QP Technologies offers comprehensive services for custom substrate development, from design to fabrication and assembly. Our combination of quality, variety, and speed meets the demands of various markets, including military, medical, and sensors. Our domestic fab and cost-reducing approach provides convenience and efficiency. Most importantly, our dedicated team is passionate about working closely with customers on their unique chip designs and finding the best solutions for the most complex requirements.

If you would like to explore our substrate capabilities, visit our website at https://www.qptechnologies.com/products/substrate-development/ and learn more about our experience with custom substrates by downloading our latest whitepaper: https://www.qptechnologies.com/custom-substrates-expertise/

The post Leveraging Custom Substrates to Deliver Quickturn Packaging and Assembly Solutions appeared first on QP Technologies.

• Our latest custom substrates white paper
• Our new state-of-the-art dicing saw
• Employee Spotlight: Matt Hansen
• Recent articles featuring our QP and Promex experts
• Recaps of recent events and a list of upcoming events where our team will be exhibiting

The post July 2024 Newsletter appeared first on QP Technologies.

SANTA CLARA, Calif., July 29, 2024 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, and its San Diego-based division QP Technologies, a leading provider of innovative microelectronic packaging and assembly solutions, today announced a sales/marketing reorganization aimed at growing both companies’ core businesses. As part of this effort, key changes have been implemented at the executive level at both sites. Rosie Medina, who has served as vice president of sales and marketing for both companies over the past several years, was named senior vice president of sales and marketing for Promex’ Santa Clara site.

“As our business expands, we are focused on engaging with a broader customer set,” said Dave Fromm, Promex chief operations officer. “Rosie has proven adept at establishing and building customer relationships. In her new role, she will take the lead in identifying new customers and educating them about Promex’s central value: helping solve difficult product development problems and building complex, high-value subassemblies for advanced applications such as medtech/biotech devices and MEMS and sensors.”

On the QP Technologies side, Matt Hansen has been promoted to VP of sales and marketing from his prior position as director of sales and business development for Promex. In this role, Hansen will leverage his experience to pursue new customers for QP Technologies in such key markets as the rapidly growing military-aerospace arena. Already ITAR-registered, the company is actively pursuing certification in AS9100, the international Quality Management System standard for the aviation, space and defense industry. Compliance with AS9100 is vital to gaining access to large OEMs and the broader supply chain.

Ken Molitor, chief operating officer for QP Technologies, noted, “Rosie has done a fantastic job for us over the past nine years. With that said, Matt’s two-plus decades of experience in sales and business development and proven track record in revenue growth make him a valued addition to the QP team. We are the leader in quick-turn and low-medium volume, turnkey onshore IC packaging and assembly services, and having Matt dedicated to QP Technologies will allow us to enhance our customers’ overall experience.”

The reorganization was prompted by both companies’ continued strong growth, which has also fueled expansion of their respective manufacturing lines. QP Technologies is seeing strong demand from global customers across its offerings – in particular, for its air-cavity open-molded plastic packages (OmPP) and its custom turnkey solutions for high-performance, substrate-based assemblies. Promex experienced double-digit growth in fiscal 2024 (ended June 30), driven by escalating demand for its ability to solve complex integrated device challenges, including precision miniaturization processes for MEMS and sensor devices.

The post Promex Industries and QP Technologies Implement Sales/Marketing Reorganization, Promoting Rosie Medina to Promex Senior Vice President and Matt Hansen to QP Technologies Vice President appeared first on QP Technologies.

ESCONDIDO, Calif. – June 19, 2024 – QP Technologies, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has added a state-of-the-art dicing saw to its manufacturing line, expanding its die and wafer preparation business. The Disco DFD6362, QP Technologies’ first fully automated dicing system, enables a full cassette of 300mm wafers to be processed quickly and efficiently, improving turnaround time and productivity for client projects. Further extending its wafer prep proficiencies, the company recently installed an additional die sorter, a Royce Autoplacer MP 300, enabling precise, mechanized, non-surface-contact pick-and-place of die during assembly.

The new Disco DFD6362 tool delivers about 7% higher throughput compared to existing equipment under the same conditions, thanks to its higher dual-cut processing speed and improved X-axis processing feed speed. The tool’s automated flow smoothly moves workpieces between the cassette, the chuck table (for cutting), and the spinner table (for cleaning and drying). The tool quickly and efficiently cuts narrower streets, enabling customers to fit more die onto their costly wafers, increasing throughput and speeding time to market for their devices.

“We are seeing heightened demand for our die preparation services as customers are building die on larger wafers,” said Ken Molitor, QP Technologies’ chief operating officer. “As a longtime Disco customer, we selected the DFD6362 not only for its ability to handle 300mm wafers in high volumes, but also its improved quality and precision. We are excited at the new opportunities we see on the horizon for our full complement of services.”

The U.S. CHIPS and Science Act and other government-funded technology programs are fueling reshoring of semiconductor manufacturing by establishing the innovation ecosystem needed to optimize new chip fabrication facilities. As chipmakers build and bring these new, high-volume fabs online, they will be seeking U.S.-based companies that can deliver wafer prep, packaging and assembly. With its proven capabilities, team of skilled experts, and broadened equipment line, QP Technologies is well positioned to play an even more vital role in this new ecosystem.

Visit QP Technologies in booth 842 at Sensors Converge, June 24-26, 2024, at the Santa Clara Convention Center to learn about the company’s full portfolio of wafer preparation, packaging and assembly, and substrate development capabilities, and their application for a range of device types, including MEMS and sensors. At the conference, David Fromm, COO of QP Technologies’ parent company Promex Industries, will give a presentation titled “Design Considerations for Building Heterogeneously Integrated Devices” on Tuesday, June 25, 2:40-3:00 p.m., in Grand Ballroom G.

The post QP Technologies™ Expands Die Preparation Business appeared first on QP Technologies.

ESCONDIDO, Calif. – April 11, 2024 – QP Technologies, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has been certified ANSI/ESD S20.20-compliant by TÜV SÜD America Inc. – one of only six certification bodies accredited to issue ESD S20.20 certificates. Established and governed by the American National Standards Institute (ANSI), the ESD S20.20-2021 standard provides requirements for establishing, implementing, and maintaining an electrostatic discharge (ESD) control program.

Defined by ANSI as “the rapid, spontaneous transfer of electrostatic charge induced by a high electrostatic field,” ESD has the potential to cause great damage to or even destroy electrical and electronic products, parts and materials. Implementing documented processes for monitoring and control of ESD is vital to ensuring product quality.

In January 2024, TÜV SÜD representatives performed an intensive audit of QP Technologies’ manufacturing facility in Escondido, California. The certifications team confirmed the ESD safety and compliance of QP Technologies’ IC packaging and microelectronic assembly line. The company’s quality engineers are trained to perform monthly monitoring and recordkeeping to maintain compliance. The resistivity of all surfaces that come in contact with parts, components and packages is measured, including furniture, table and floor mats, racks, shelves, carts, trays, and personal protective equipment (PPE) worn by packaging and assembly technicians, such as wrist straps, heel straps and ESD shoes. To be classed as ESD safe, a material’s surface resistance must not exceed 1x 10E¹¹ Ω/square.

“Multiple customers, particularly larger companies, have increasingly requested that we become ESD certified. While we have taken steps to minimize ESD damage for many years, as a result of this latest audit, we have added and are regularly performing additional testing and monitoring processes to qualify all of the equipment and materials we use throughout our manufacturing line,” said QP Technologies Director of Quality Assurance Annette Aquino. “Having a formal ESD S20.20-certified facility with an ESD control program in place further assures customers of our role as a trusted partner.” The ESD S20.20 standard applies to organizations that manufacture or handle electrical and electronic parts and equipment susceptible to damage by ESD ≥100V human body model and 200V charged device model. ESD can occur due to human contact with an electrical part, or to static created through the part’s interaction with other materials. This latest certification comes on the heels of QP Technologies’ recent update of its ISO 9001:2015 and ISO 13485:2016 certifications through TÜV SÜD, exemplifying the company’s comprehensive commitment to quality and safety.

The post QP Technologies™ Achieves ANSI/ESD S20.20 Certification appeared first on QP Technologies.

• Our latest ISO certificates from TUV SUD America
• Customer benefits of our Epicor ERP System
• Employee Spotlight: Silvia (Gaby) Licht
• Recent articles featuring our experts on industry growth drivers and power devices
• Upcoming events where our team will be exhibiting

The post February 2024 Newsletter appeared first on QP Technologies.

QP Technologies

In July 2023, TÜV SÜD representatives performed an intensive one-week audit onsite at QP Technologies’ manufacturing facility in Escondido, California. During the audit, the certifications team confirmed the quality assurance system and general operative processes for QP Technologies’ IC assembly, packaging and microelectronic assembly services were in conformance to the ISO standards. “This updated certification of our facilities is vital to our ongoing commitment to deliver the utmost quality of work to our customers, providing an additional level of trust in our packaging and assembly processes,” said Annette Aquino, QP Technologies’ quality assurance manager.

TÜV SÜD’s large global footprint as well its comprehensive certification capabilities convinced QP Technologies to replace its prior ISO registrar firm. Ken Molitor, QP Technologies’ chief operating officer, noted, “Working with TÜV SÜD will allow us to pursue additional certifications – most notably, AS9100, which is key to reaching the broader aerospace and defense markets.” Compliance with AS9100 is required by major aerospace manufacturers and suppliers as a condition of doing business with them.

TÜV SÜD is accredited by the ANSI National Accreditation Board (ANAB), a subsidiary of the American National Standards Institute (ANSI). ANAB is also a member of the International Accreditation Forum (IAF), a worldwide association of accreditation and other bodies that exist to assess and assure businesses conform to a wide range of management systems and processes. This extensive pedigree ensures the credibility of TÜV SÜD’s programs, including electrostatic discharge (ESD) certification, which QP Technologies will also pursue going forward.

The post QP Technologies™ Achieves ISO Certifications from Global Auditing and Certification Body TÜV SÜD America Inc. appeared first on QP Technologies.

The post November 2023 Newsletter appeared first on QP Technologies.