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QP Technologies provides prototype and small-volume IC packaging and IC assembly services. The company specializes in providing full turn-key solutions that help get your design to market quickly.
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You may remember us as Quik-Pak, founded in 1992 and acquired by Promex Industries in 2015. Today, QP Technologies is a leading provider of microelectronic packaging and assembly, wafer preparation, and substrate design and development services. We leverage proven technologies developed by our skilled staff, and we work closely with you to get your products to market quickly, with the highest quality and in low or high volumes.
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Whether you need wafer thinning, a fast-turn prototype, or a custom solution for mid-volume manufacturing, we offer a range of services to meet your packaging and assembly requirements. Read More
Our Products
At QP Technologies, we are committed to sustaining and growing our line of industry-leading packages and substrate capabilities to ensure we have what you need when you need it. Read More
Packaging Solutions for the Mil-Aero Market
Our broad, U.S.-based package and assembly capabilities are ideal for military-aerospace applications. We develop board and IC solutions using traditional leaded plastic packages, Open-cavity Plastic Packages (OCPP), or our Open-molded Plastic Package (OmPP) technology. We also offer complete MIL-STD and custom environment screenings per the MIL-STD-883/M5004 Class Level B process.
Compound and Power Semiconductors
Compound semiconductor materials such as silicon carbide (SiC), gallium nitride (GaN) and aluminum nitride (AlN) are ideally suited to optimizing functionality in power ICs. Our custom packaging designs can help maximize power product lifecycles, yielding a repeatable assembly solution for your power devices.
OmPP
When you need a high-quality, fast solution for your IC packaging and assembly needs, we have the answer. Our exclusive Open-molded Plastic Packages (OmPP) are a line of pre-molded, air-cavity quad flat no-lead (QFN) packages that come in a variety of sizes and are ideal for prototype, mid volume or production volume applications.